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ADuM5400
APPLICATIONS INFORMATION
Data Sheet
The dc-to-dc converter section of the ADuM5400 works on
principles that are common to most modern power supplies. It
has a secondary side controller architecture with isolated pulse-
BYPASS < 2mm
V DD1
GND 1
V IA
V ISO
GND ISO
V OA
width modulation (PWM) feedback. V DD1 power is supplied to
an oscillating circuit that switches current into a chip scale air
core transformer. Power transferred to the secondary side is
rectified and regulated to 5 V. The secondary (V ISO ) side
controller regulates the output by creating a PWM control
V IB
V IC
V ID
V DDL
GND 1
ADuM5400
V OB
V OC
V OD
V ISO
GND ISO
signal that is sent to the primary (V DD1 ) side by a dedicated
i Coupler data channel. The PWM modulates the oscillator
circuit to control the power being sent to the secondary side.
Feedback allows for significantly higher power and efficiency.
The ADuM5400 implements undervoltage lockout (UVLO)
with hysteresis on the V DD1 , V DDL , and V ISO power supplies. This
feature ensures that the converter does not enter oscillation due
to noisy input power or slow power-on ramp rates.
PCB LAYOUT
The ADuM5400 digital isolator with integrated 0.5 W iso Power
dc-to-dc converter requires no external interface circuitry for the
logic interfaces. Power supply bypassing is required at the input
and output supply pins (see Figure 13). Note that a low ESR bypass
capacitor is required between Pin 1 and Pin 2, within 2 mm of
the chip leads.
The power supply section of the ADuM5400 uses a 180 MHz
oscillator frequency to efficiently pass power through its chip
scale transformers. In addition, normal operation of the data
section of the i Coupler introduces switching transients on the
power supply pins. Bypass capacitors are required and must
provide transient suppression at several operating frequencies.
Noise suppression requires a low inductance, high frequency
capacitor that is effective at 180 MHz and 360 MHz. Ripple
suppression and proper regulation require a large value capacitor
to provide bulk current at 625 kHz. These are most conveniently
connected between Pin 1 and Pin 2 for V DD1 and between Pin 15
and Pin 16 for V ISO . To suppress noise and reduce ripple, a
parallel combination of at least two capacitors is required. The
recommended capacitor values are 0.1 μF and 10 μF for V DD1 .
The smaller capacitor must have low ESR; for example, use of a
ceramic capacitor is advised.
Note that the total lead length between the ends of the low ESR
capacitor and the input power supply pin must not exceed 2 mm.
Installing the bypass capacitor with traces more than 2 mm in
Figure 13. Recommended PCB Layout
In applications involving high common-mode transients, ensure
that board capacitive coupling across the isolation barrier is
minimized. Furthermore, design the board layout so that any
coupling that does occur affects all pins on a given component
side equally. Failure to ensure this can cause differential voltages
between pins, exceeding the absolute maximum ratings for the
device (specified in Table 10) and thereby leading to latch-up
and/or permanent damage.
The ADuM5400 is a power device that dissipates about 1 W
of power when fully loaded and running at maximum speed.
Because it is not possible to apply a heat sink to an isolation
device, the device depends primarily on heat dissipation into
the PCB through the GND pins. If the device is used at high
ambient temperatures, provide a thermal path from the GND
pins to the PCB ground plane. The board layout in Figure 13
shows enlarged pads for Pin 8 (GND 1 ) and Pin 9 (GND ISO ).
Large diameter vias should be implemented from the pad to the
ground, and power planes should be used to reduce inductance.
Multiple vias in the thermal pads can significantly reduce temper-
atures inside the chip. The dimensions of the expanded pads are
at the discretion of the designer and depend on the available
board space.
EMI CONSIDERATIONS
The dc-to-dc converter section of the ADuM5400 component
must operate at a very high frequency to allow efficient power
transfer through the small transformers. This creates high
frequency currents that can propagate in circuit board ground
and power planes, causing edge emissions and dipole radiation
between the primary and secondary ground planes. Grounded
enclosures are recommended for applications that use these
devices. If grounded enclosures are not possible, follow good
RF design practices in the layout of the PCB. See the AN-0971
Application Note for board layout recommendations.
length may result in data corruption. Consider a bypass capacitor
between Pin 1 and Pin 8 and between Pin 9 and Pin 16 unless
both common ground pins are connected together close to the
package.
Rev. B | Page 12 of 16
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